HBM, GDDR, packaging, and the interposers that move data.
A leaker claims that 4 GB and 6 GB GDDR7 memory chips will be introduced for next-gen GPUs in the next two years.
According to Wccftech Hardware, a leaker claims that 4 GB and 6 GB GDDR7 memory chips will be rolled out for next-generation GPUs in either 2027 or 2028.…
According to Wccftech Hardware, Samsung is set to boost its production of HBM4 memory chips by 2.5 times by 2027, driven by high demand for AI chips.
According to Wccftech Hardware, Samsung is set to boost its production of HBM4 memory chips by 2.5 times by 2027, driven by high demand for AI chips. The…
Kioxia's XL1 is an XL-FLASH Generation 2 NAND device that attaches to a system as a 512GB memory expansion via CXL.
According to ServeTheHome, Kioxia's XL1 is an XL-FLASH Generation 2 NAND device that attaches to a system as a 512GB memory expansion device via CXL. The mechanism is…
University of Michigan researchers published 'Fengshui,' a chiplet co-design framework that jointly optimizes chiplet pool composition and bespoke ASIC design for AI accelerators.
According to Semiconductor Engineering, University of Michigan researchers published a technical paper titled 'Fengshui: Demystifying Chiplet Ecosystem and Bespoke Neural Network Accelerator Codesign.' The framework jointly optimizes chiplet…
Heidelberg University researchers published a paper on a unified interconnection network for chiplet-based scaling of the BrainScaleS neuromorphic system.
According to Semiconductor Engineering, Heidelberg University researchers published a technical paper titled 'A Unified Interconnection Network for Chiplet-Based Scaling of the BrainScaleS Neuromorphic System.' The paper addresses the…