TSMC CoWoS price adjustment runs 10% to 20%
TSMC CoWoS pricing is adjusting upward 10% to 20%, per supply-chain sources in the China Times report, as packaging capacity tightens.
| TSMC CoWoS | |
|---|---|
| price adjustment | 10%-20% |
| 2026 monthly capacity | more than 130,000 wafers |
| 2027 target | 200,000 wafers |
| 5x reticle-size | volume production |
| 9x and 14x | in development |
| CoPoS | being advanced |
| U.S. AP1 start | 2028 |
The range does not confirm a TSMC price, a per-wafer figure, or a customer-level contract. It marks a pricing conversation under tight packaging capacity.
The constraint sits in the interposer, test, and equipment queue. Equipment lead times stretch from 3-6 months to 6-8 months, and a new advanced packaging plant needs about three years to reach full load at bottleneck stations.
Buyers with locked CoWoS slots carry less bargaining power than buyers who can wait. The document lists 2026 monthly capacity moving toward more than 130,000 wafers and a 2027 target of 200,000, but those targets do not remove the near-term squeeze.
The missing measurements are the actual CoWoS price per package, the current lead time in weeks, and whether the adjustment applies to all customers or only new orders.
No confirmed CoWoS price, per-package figure, or current lead time in weeks appears in the document.
The 10% to 20% range is a supply-chain signal, not a confirmed TSMC price. The piece keeps the qualification visible and does not overstate what the document establishes.
After chinatimes.com. We did not report this. The pictures, if any, are theirs.
