SOCAMM3 targets CPUs from 2028, with Nvidia Rosa and the Rosa Feynman platform listed as the first targets. ComputerBase ties AMD's Florence to LPDDR support at end 2028, while Verano can support SOCAMM from early 2027. Specified earlier module is 90 mm long, 14 mm wide, uses four memory chips on top, has 694 I/O contacts below, and is fastened with three screws.

Constraint sits on module makers, not CPU buyers. TLB is already making SOCAMM PCBs and is in talks with two customers, but final SOCAMM3 specifications are not set, so no buyer can price a 2028 system from this page, even though the PCB and substrate complexity supports a higher price than U-DIMMs or R-DIMMs. Earlier 90 mm by 14 mm module sits outside the SOCAMM3 limit, because the final specification is not set.

Final SOCAMM3 dimensions, contact count, capacity, power, price, exact mass-production start beyond 2028, customer names, and socket details are still unmeasured. LPDDR6 pairing is likely, but that pairing is not a confirmed specification. Page leaves the third-generation module as a target, not a finished part for now.

The constraint is on module makers, not CPU buyers. The earlier module sits outside the SOCAMM3 limit because the final specification is not set.

Final SOCAMM3 dimensions, contact count, capacity, power, price, exact mass-production start beyond 2028, customer names, and socket details are not measured.

Module makers face a spec gap: TLB has PCB and substrate work in hand, but final SOCAMM3 dimensions, contacts, capacity, power, and price are unset. The 90 mm by 14 mm, four-chip, 694-contact, three-screw module is a mechanical proof, not a SOCAMM3 baseline.