Foundry
Nodes, yield, and the fabs the leaks point at.
Samsung 8LPU+ ties to a rumored Switch 2 Lite
A rumored Switch 2 Lite could use Samsung's 8LPU+ process, which the company says cuts power by 15% over 8LPU.
Terafab gets a test chip window and a volume date
May or June is the window for the first test chip, and Q3 2028 is the early volume date, but the filing names no chip, node, or customer.
Terafab shifts from plant purchase to supplier assembly
More than half of the Korean suppliers in Terafab talks have signed NDAs, a sign the project is assembling a supply chain rather than buying a fab.
GTC Berlin speaker list omits Intel and leaves the Feynman packaging role open
The Berlin GTC speaker list omits Intel, AMD, Micron, SK hynix, Samsung, Broadcom, and Marvell, leaving the Feynman packaging question open.
TSMC A14 mass production target shifts to first half 2028
AI demand is tightening leading-edge wafer supply, and TSMC's A14 mass production target now sits in the first half of 2028.
Named customers change Intel Foundry's demand picture
The change is a named customer list, with Broadcom, Google, Apple, AMD, Microsoft, and NVIDIA listed as Intel Foundry wins while AWS, Anthropic, and SpaceX Terafab remain in evaluation.
TCL's IJP OLED route moves to Gen 8.6
Inkjet printing is the change Omdia ties to TCL CSOT's Gen 8.6 Guangzhou route, with 32-inch and 34-inch panels and up to 700Hz refresh planned for 2028.
TSMC's margin floor, not its call date, is the signal
Pricing room, not a fab commitment, is what the TSMC page offers: a 56 percent gross-margin floor for 2024 to 2029, and a 15 October 2026 earnings call.
Anthropic's reported Samsung accelerator is a pilot, not a confirmed fab deal
Anthropic's reported accelerator would run at 4,000 TOPS at INT8 and 1,300 W TDP, but Samsung has not confirmed the foundry agreement.
The sublease question outranks the 14A line
The floated cleanroom sublease is the open question in the Tom's Hardware wire, not the 14A node name.
China DUV stockpile and 7nm claim
The page reports 343 immersion DUV tools in China and a claim that 270 ASML scanners can print 7nm processors without sanctioned EUV tools.
TSMC's second U.S. park is still a constraint, not a commitment
TSMC's Arizona cluster now holds 12 wafer fabs, advanced packaging, and an R&D center; a single X post citing digitimes says a second U.S. park in Texas is under evaluation.
Samsung foundry loss narrows 41 percent on HBM4 base-die volume
Kiwoom Securities projects Samsung's foundry operating loss will shrink from 6.74 to 3.92 trillion won in 2026, driven by HBM4 base-die volume on the 4nm process.
Parasitic RC isolation in A7 CFET and A10 NSFET via a thermal-aware STCO flow
TU Munich, UNIMORE, and Applied Materials published a physics-based STCO flow that isolates parasitic RC in A7 CFET and A10 NSFET using a single device model across both nodes.
Qualcomm's first GAAFET mobile die pushes Oryon cores to 5GHz
Qualcomm's Snapdragon 8 Elite Gen 6 and Elite Extreme Gen 6 run Oryon V4 cores at 5.0GHz on TSMC's first GAAFET node, N2P, with LPDDR6 memory at 127.2GB/s.
TSMC's advanced node progress is why samsung may never close the gap
TSMC is making excellent progress with its 1.4nm node, with trial production as early as Q1 2027, and its 3nm process reaching a new milestone as AI chip demand shows no signs of slowing.
Fab robotics moves from pilot to baseline as single-fab costs reach $20 billion
Intel Foundry deploys Boston Dynamics quadruped robots to perform 16 preventive inspection tasks across subfab and utility infrastructure.
TSMC's Operations Boss Says AI Cannot Fully Overcome Next-Gen Chip Design Limitations
TSMC's co-chief operating officer Y. J. Mii says AI is akin to a three-year-old Superman, and humans should be the only ones who make decisions when it comes to AI.
A14 CMOS nanoflex pro platform at IEEE IEDM 2026
At IEEE IEDM 2026, the A14 CMOS NanoFlex Pro platform technology was presented, with 2nd Gen Nano-sheet and full node PPA benefits for HPC/AI and mobile SoC applications.