SK hynix consults partners on iHBM mass production
The base die's D2D PHY section carries the cooling elements, and SK hynix is consulting materials and equipment partners about iHBM mass production.
| iHBM | |
|---|---|
| thermal resistance reduction | 30% or more |
| cooling elements | ICE on base die D2D PHY |
| packaging | MR-MUF wafer-level packaging |
| target generation | HBM5 |
| roadmap date | 2029 |
| validation | TSMC CoWoS |
The 30% figure is a design claim for thermal-resistance reduction, not a measured value. It does not prove a production date or a buyer-visible price.
ETNews reports the company is talking to domestic and foreign materials and equipment suppliers about mass production and commercialization. MR-MUF wafer-level packaging keeps the supply chain close to existing HBM.
HBM5 remains under validation on TSMC CoWoS, and the 2029 roadmap date leaves no measured gap between the claim and a shipped part.
No measured thermal resistance, power draw, stack height, capacity, bandwidth, node, yield, price, or mass-production start date appears in the document.
The 30% figure is a design claim, not a production proof. The piece tracks the supply chain consultation without overstating what has been measured.
After etnews.com. We did not report this. The pictures, if any, are theirs.
