MaxLINC holds 400 W/cm² on a warped silicon die
NovoLINC's MaxLINC test held a production-representative silicon die at 400 W/cm² and 3,300 W total power while junction temperature stayed below 90°C.
That flux number does not prove the interface survives a real data center, because the NovoLINC filing still leaves die area, contact pressure, gap thickness, thermal resistance, test duration, and package size unmeasured.
The desk reads the 3,300 W total power and sub-90°C junction result as a compliance claim, not a durability claim. It shows a CoolIT single-phase cold plate and MaxLINC can carry a multi-kilowatt die through one measured state, with about 150 µm of warpage, but it omits repeated cycling, vibration, and long-term contact drift. For a buyer, the useful constraint is that the interface must still be qualified under the actual package stack, not just a production-representative test die in the field.
No cycling data appear in it. The document names no die area, contact pressure, gap thickness, thermal resistance, test duration, or package size.
The filing proves one thermal state, not a service life. The buyer's constraint is qualification under the real package stack, not the demo die.
The document leaves out die area, contact pressure, gap thickness, thermal resistance, test duration, and package size.
The demo validates heat transfer at 400 W/cm² and 3,300 W, but it omits pressure, gap, duration, and cycling, so it is a thermal proof point, not a qualification record.
400 W/cm² uniform heat flux · 3,300 W total power · approximately 150 µm warpage · silicon junction temperature below 90°C · CoolIT single-phase direct liquid cooling cold plate · MaxLINC nanostructured composite architecture
After prnewswire.com. We did not report this. The pictures, if any, are theirs.
