GTC Berlin speaker list omits Intel and leaves the Feynman packaging role open
The Berlin GTC speaker list omits Intel, AMD, Micron, SK hynix, Samsung, Broadcom, and Marvell, leaving the Feynman packaging question open.
| Intel Xeon | Feynman | |
|---|---|---|
| DGX systems | DGX B300 and DGX Rubin NVL8 | Feynman-based DGX systems |
| host CPU | DGX B300 and DGX Rubin NVL8 | Xeon likely still host CPU |
| I/O die node | 18A-P or 14A | 18A or 14A |
| packaging | EMIB-T or Foveros | EMIB or Foveros |
| EMIB share | 25 percent |
The catalog's 142 external speakers sit at the stated limit. Die Brief reads the omission as a constraint on Intel, not on NVIDIA.
The document does not prove that Intel will receive Feynman I/O-die work or EMIB or Foveros packaging. It also does not name a host-CPU role beyond the DGX stack already described.
A buyer who values Intel on NVIDIA exposure is buying optionality. The 25 percent EMIB share and 18A or 14A I/O-die claims remain unconfirmed in the Wccftech preview and the @imnotharsh note, citing Digitimes.
The open questions are whether Huang names Xeon as the Feynman host CPU, whether the I/O die moves to Intel 18A-P or 14A, and whether packaging capacity shifts from CoWoS to EMIB-T or Foveros. Huang's talk can move the rumor from a supplier question to a fab allocation, but the catalog does not show that shift.
No benchmark, yield, or allocation figure is attached to the 25 percent share. The document does not measure yield, power, price, or a confirmed Feynman allocation for Intel.
The catalog leaves Intel's Feynman packaging role open, not confirmed.
After @Schulz_Research. We did not report this. The pictures, if any, are theirs.
