The ComputerBase article puts Terafab's investment at $16.8 billion and states that this sum corresponds to a single greenfield memory fab producing roughly 45,000 wafers per month, a figure the article calls far too small for the stated target. The Sawyer Merritt post on X describes the same Grimes County site as having "more than 100 million square feet of manufacturing space," ten times the footprint of Tesla Giga Texas. The square footage matches; the capital does not.

Seven hundred thousand DRAM wafers per month is the memory target Terafab communicated to suppliers, and Samsung is spending hundreds of billions to double its own output from 650,000 to 1.45 million wafers per month. A $16.8 billion envelope covers roughly six percent of Terafab's stated memory capacity, which makes the X post a construction-progress photo rather than a funding schedule. The party constrained is the buyer: Optimus and the space data centers will wait on a fab whose capital plan covers a fraction of its stated output, and the gap between 45,000 and 700,000 wafers is not a scheduling problem.

No process node, no lithography vendor, no electrical load, and no confirmed TSMC equity structure appear in any document. The 700,000/300,000 split reached suppliers through Nikkei, not through a fab schedule. First volume production is slated for Q3 2028, but nothing in the document names the process node or the equipment that will be running then.

The $16.8 billion envelope covers about six percent of the 700,000-wafer memory target, which means the buyer of Optimus and space-data-center chips is the party constrained. The X post presents a construction milestone; the ComputerBase article presents a budget gap.

No process node, lithography vendor, electrical load, or confirmed TSMC equity structure appears in any document.

At $16.8 billion, the capital plan funds one greenfield memory fab at roughly 45,000 wafers per month. The 700,000-wafer DRAM target requires the order of investment Samsung is committing to double its own output from 650,000 to 1.45 million. No process node, lithography vendor, or power load is named in any document.